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NCP3418B
MAXIMUM RATINGS
Rating
Operating Ambient Temperature, T A
Operating Junction Temperature, T J (Note 1)
Package Thermal Resistance: SO?8
Junction?to?Case, R q JC
Junction?to?Ambient, R q JA (2?Layer Board)
Package Thermal Resistance: DFN?10 (Note 2)
Junction?to?Case, R q JC (From die to exposed pad)
Junction?to?Ambient, R q JA
Storage Temperature Range, T S
Value
0 to 85
0 to 150
45
123
7.5
55
?65 to 150
Unit
° C
° C
° C/W
° C/W
° C/W
° C/W
° C
Lead Temperature Soldering (10 sec): Reflow (SMD styles only)
JEDEC Moisture Sensitivity Level
Pb?Free (Note 3)
SO?8 (260 peak profile)
260 peak
1
° C
?
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Internally limited by thermal shutdown, 150 ° C min.
2. 2 layer board, 1 in 2 Cu, 1 oz thickness.
3. 60?180 seconds minimum above 237 ° C.
NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.
MAXIMUM RATINGS
Pin Symbol
V CC
BST
Pin Name
Main Supply Voltage Input
Bootstrap Supply Voltage Input
V MAX
15 V
30 V wrt/PGND
35 V v 50 ns wrt/PGND
V MIN
?0.3 V
?0.3 V wrt/SW
15 V wrt/SW
SW
DRVH
Switching Node
(Bootstrap Supply Return)
High?Side Driver Output
30 V
BST + 0.3 V
35 V v 50 ns wrt/PGND
?1.0 V DC
?10 V< 200 ns
?0.3 V wrt/SW
15 V wrt/SW
DRVL
Low?Side Driver Output
V CC + 0.3 V
?0.3 V DC
?2.0 V < 200 ns
IN
OD
PGND
DRVH and DRVL Control Input
Output Disable
Ground
V CC + 0.3 V
V CC + 0.3 V
0V
?0.3 V
?0.3 V
0V
NOTE:
All voltages are with respect to PGND except where noted.
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